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 DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUIT
PC8001
IF AMPLIFIER IC WITH ON-CHIP MIXER FOR DIGITAL CELLULAR PHONES
The PC8001 is a 3-volt IF amplifier IC with an on-chip mixer developed for digital cellular phones. The PC8001 consists of a high-sensitivity limiter amplifier with an input frequency of 455 kHz, a high-speed and high-precision linear RSSI (received signal strength indicator ), and a second mixer with an input frequency of 80 to 150 MHz. The PC8001 features a low 3 mA (TYP.) and 2.2 A (TYP.) current consumption at normal operation and power-OFF, respectively. Its high-speed charge/discharge circuit enables fast power-ON/OFF switching. The PC8001 boasts an extremely small size packaged in a 14-pin plastic shrink SOP, and low external capacitances of less than 0.01 F, in addition to an on-chip RSSI output resistor, and is most suitable for high-density mounting. FEATURES * Low-voltage operation...3 V 10% * Low power consumption...(VCC = 3 V)
Mixer During operation At power-OFF 2.1 mA (TYP.) 0 A (TYP.) IF amp. + RSSI 0.95 mA (TYP.) 2.2 A (TYP.)
* High limiting sensitivity...-91 dBm (TYP.) * High-precision RSSI linearity...0.5 dB (TYP.) (VIF IN = -86 to -6 dBm) * High-speed RSSI response time
RSSI output rise time RSSI output fall time 77s (TYP.) 113 s (TYP.)
* High-speed power-ON/OFF switching time Rise time at power-ON Fall time at power-OFF 174 s (TYP.) 3 s (TYP.)
* External capacitors of less than 0.01 F * On-chip RSSI output resistor (34 k) * Ultra-compact package...14-pin plastic shrink SOP
The information in this document is subject to change without notice. Document No. IC-3426 (O.D.No. IC-8949) Date Published February 1995 P Printed in Japan
The mark 5 shows revised points.
(c)
(c)
1994, 1995 1992
PC8001
ORDERING INFORMATION
Part number Package 14-pin plastic shrink SOP (225 mil) 14-pin plastic shrink SOP (225 mil)
PC8001GR
PC8001GR-E1
Embossed carrier taping (Pin 1 located toward tape unwind direction) 14-pin plastic shrink SOP (225 mil)
PC8001GR-E2
Embossed carrier taping (Pin 1 located toward tape wind direction)
2
PC8001
BLOCK DIAGRAM
Antenna
1 st L-osc
1.5 GHz or 900 MHz
RF Amp
1 st Mixer
130 MHz BPF
455 kHz BPF Note RM 1.4 k
2 nd L-osc 129.545 MHz
CIF CFL3 0.01 F 0.01 F 0.01 F 0.01 F 0.01 F 0.01 F 0.01 F 11 13 9 8 4 6 14 IF IN FIL3 FIL2 OSC IN MIX IN2 MIX IN1 MIX OUT COS CM2 CM1 CM0 CFL2
CFL1 0.01 F 7 FIL1
2 nd Mixer
IF Amp
1 IF OUT
RSSI RSSI OUT
3 CRS 1000 pF
12 VCC1
2 PD
5
10
VCC2 GND
Note Input/output impedance of 455 kHz BPF: 1.5 k
3
PC8001
CONTENTS
1. PIN CONFIGURATION AND PIN FUNCTIONS ............................................................................... 5 2. I/O EQUIVALENT CIRCUIT ............................................................................................................... 7 3. ELECTRICAL SPECIFICATIONS ........................................................................................................ 8 4. CHARACTERISTIC CURVES ........................................................................................................... 14 5. TEST CIRCUIT EXAMPLE ............................................................................................................... 18 6. PACKAGE DRAWINGS .................................................................................................................... 19 7. RECOMMENDED SOLDERING CONDITIONS ............................................................................ 20
4
PC8001
1.
(1) *
PIN CONFIGURATION AND PIN FUNCTIONS
PIN CONFIGURATION (Top View) 14-pin plastic shrink SOP (225 mil)
IF OUT PD RSSI OUT FIL3 VCC2 IF IN FIL1
1 2 3 4 5 6 7
14 13 12 11 10 9 8
MIX IN1 MIX IN2 VCC1 OSC IN GND MIX OUT FIL2
PC8001GR
FIL1-FIL3 GND IF IN IF OUT MIX OUT OSC IN PD RSSI OUT VCC1, VCC2
: Filter : Ground : Intermediate Frequency Input : Intermediate Frequency Output : Mixer Output : Oscillator Input : Power Down : Received Signal Strength Indicator Output : Power Supply
MIX IN1, MIX IN2 : Mixer Input
5
PC8001
(2) PIN FUNCTIONS
Number 1 2 3 4 5 6 7 8 9 10 11 12 13 14 Pin Name IF OUT PD PSSI OUT FIL3 VCC2 IF IN FIL1 FIL2 MIX OUT GND OSC IN VCC1 MIX IN2 MIX IN1 I/O O I O -- -- I -- -- O -- I -- I I IF amplifier output Power-ON/OFF control signal input High level: Power-ON; Low level: Power-OFF RSSI output Connect capacitor for filter. IF amplifier and RSSI power pin IF amplifier input Connect capacitor for filter. Connect capacitor for filter. Mixer output Ground pin Oscillator input Mixer power pin Connect capacitor for filter. Mixer input Function
6
PC8001
2. I/O EQUIVALENT CIRCUIT
Mixer input
5 k
IF amplifier output
5 k 75 A
1
14
13
Oscillator input
5 k
RSSI output
V CC2
34 k 5 k 3
500 11
IF amplifier input
Power-ON/OFF input
300 k
6
4
1.5 k 7 8
150 k 2
50 k
Mixer output
9 400 A
7
PC8001
3. ELECTRICAL SPECIFICATIONS
Absolute Maximum Ratings (TA = 25C)
Parameter Supply voltage Total power dissipation Operating ambient temperature Storage temperature Symbol VCC PT TA Tstg Conditions Rating 7 300 -30 to +85 -40 to +125 Unit V mW C C
Caution
Exposure to Absolute Maximum Ratings for extended periods may affect device reliability; exceeding the ratings could cause permanent damage. The parameters apply independently. The device should be operated within the limits specified under DC and AC Characteristics.
Recommended Operating Conditions (TA = 25C)
Parameter Supply voltage Mixer input level IF amplifier input level Oscillator input level IF amplifier input frequency Mixer input frequency Mixer output frequency Symbol VCC VMIX IN VIF IN VOSC IN fIF IN fMIX IN fMIX OUT See Figure 3-1. 50 termination LC matching Conditions MIN. 2.7 -100 -113Note2 -86 -30 400 80 400 -15 455 130 455 TYP. 3.0 MAX. 3.3 -20 Unit V dBmNote1
-33Note2 dBmNote1 -6 -5 500 150 500 dBmNote1 dBmNote1 kHz MHz kHz
Notes 1. Assuming a conversion value of 50 , 0 dBm = 0.2236 Vrms. 2. Depends on board wiring pattern, use as reference value.
8
PC8001
ELECTRICAL CHARACTERISTICS (TA = 25C, VCC1 = VCC2 = 3 V, fMIX IN = 130 MHz, fOSC IN = 129.545 MHz, fIF IN = 455 kHz, CRS = 1000pF, COS = CM1 = CM2 = CM0 = CIF = CFL1 = CFL2 = CFL3 = 0.01F, 0 dBm = 0.2236 Vrms) (1) Mixer
Parameter Supply current Symbol ICC1 No signal VMIN IN = -50dBm Conversion gain CG VOSC IN = -15 dBm See Figure 3-1. Third order intercept -1dB compression output level Cut-off frequency Noise figure Local isolation Mixer input impedance Local input impedance Output resistance Power-ON rise time
Note2
Conditions
MIN.
TYP. 2.1
MAX. 3.0 23
Unit mA
50 termination LC matching
15 33 -13 -5 200
20
Note 1
dB
IC3 VOMIX fC NF ISL ZIM ZIL ROM tONM
See Figure 3-2. VOSC IN=-15dBm See Figure 3-3. -3 dB point See Figure 3-6.
-8 0 470 10
Note 1
dBm dBm MHz dB dB 180 600
20
26 48-j383 80-j425
60 VON = 3 V Rise time of PD signal : 10 ns
120 33
s
Power-OFF fall time
Note3
tOFM ILM
VOF = 0 V Fall time of PD signal : 10 ns
3 0
200 10
s A
Power-OFF supply current
VOF = 0 V
Notes 1. Depends on board wiring pattern, use as reference value. 2. Time until DC voltage of mixer output reaches 10% of power-ON value. 3. Time until supply current reaches 10% of power-ON value.
(2)
Power-ON/OFF
Parameter Symbol VON VOF ION Conditions Power-ON over VON and under VCC Power-OFF over GND and under VOF VON = 3 V 0.6 MIN. TYP. 1.2 1.2 48 75 MAX. 2.4 Unit V V
Power-ON input voltage Power-OFF input voltage Power-ON input current
A
9
PC8001
(3) IF Amplifier/RSSI
Parameter Supply current IF amplifier output amplitude Limiting sensitivity IF amplifier input impedance IF amplifier phase variation Symbol ICC2 VO LS ZIN LRS VIF IN =-86 to -6 dBm See Figure 4-6 Note1. VIF IN = -86 to -6 dBm Recursive calculation with VIF IN = -60 to -6 dBm Recursive calculation with VIF IN = -60 to -6 dBm Recursive calculation with VIF IN = -60 to -6 dBm See Figure 3-4. VIF IN = -86 dBm VIF IN = -46 dBm VIF IN = -6 dBm VIF IN = -86 to -6 dBm, TA = -30 to +85 C VIF IN = -6 dBm See Figure 3-5. VIF IN = -6 dBm See Figure 3-5. VIF IN = -6 dBm VOF = 0 V VON = 3 V, VIF IN = -86 dBm PD signal rise time: 10 ns VOF = 0 V PD signal fall time: 10 ns VIF IN = -20 dBm Rise Fall RSSI output resistance ROR
Note4 Note5
Conditions No signal VIF IN = -20 dBm -3dB point, see Figure 4-5.
MIN.
TYP. 0.95
MAX. 1.3 1.8 -86 1.8
Unit mA Vp-p dBm k deg
1.2
1.5 -91
1.2
1.5 11 0.5
5
RSSI linearity
2
dB
RSSI slope
SLRS
22.3
24.4
30.1
mV/dB
5
RSSI intercept
ICRS
-135
-118
-104
dBm
RSSI output voltage1
VR1 VR2 VR3 ST
0.50 1.60 2.70
0.79 1.79 2.75 1
0.98 1.90 2.82
V V V dB
5
RSSI output voltage 2 RSSI output voltage 3 RSSI output temperature stability
5 5 5
RSSI rise time
trRS
77
300
s s
mVp-p
RSSI fall time RSSI output ripple Power-OFF supply current Power-ON rise time
Note2
tfRS VRRS ILI tONI
113 3 2.2 174
300 12 10 600
A s s
Power-OFF fall time Note3 IF amplifier output slew rate
tOFI SRO
3 3.4
200
V/s 3.8 27 34 41 k
5
Notes 1. Use the network analyzer at RBW = 3 Hz. 2. Time until RSSI output reaches 10% of power-ON value. 3. Time until supply current reaches 10% of power-ON value. 4. Rise: 10% to 90% 5. Fall: 90% to 10%
10
PC8001
Figure 3-1. Mixer Input
(a) 50 Termination
(b) LC Matching
VMIX IN 0.01 F 14 MIX IN1
VMIX IN
5 pF
Note
0.01 F 14 MIX IN1
Note
50
107 nH
Note The values L and C are affected by the parasitic capacitance and inductance of the board. Therefore, adjust L and C so that the impedance at the MIX IN pin from the signal source equals 50. Remark The signal source impedance is 50.
Figure 3-2. Third Order Intercept
MIX IN1 14 MIX OUT 9 0.01 F 0.01 F 1.5 k 50 16.7 Measure 455 kHz component level with spectrum analyzer fOSC IN = 129.545 MHz OSC IN 11 VOSC IN = -15 dBm 0.01 F 50
16.7
16.7
f = 130 MHz f1 f2
VMIX OUT [dBm]
6 dB/OCT f1 = 130.1 MHz f2 = 130.2 MHz
f1 = 130.1 MHz, f2 = 130.2 MHz
18 dB/OCT
VMIX IN [dBm] Third order intercept
Remark Signal source impedance is 50.
11
PC8001
Figure 3-3. -1 dB Compression Output Level Figure 3-4. RSSI Intercept
1 dB
VOMIX
V MIX IN [dBm] RSSI intercept
RSSI output VORS [V]
VMIX OUT [dBm]
IF input level VIF IN [dBm]
Figure 3-5. RSSI Response Time
IF output
90%
RSSI output
10% trRS tfRS
12
PC8001
Figure 3-6. Noise Figure Measurement
28 V
SW
5 pF 0.01F 14 MIX IN1
Noise source HP346B
107 nH
0.01F 11 50 OSC IN
47 dB Spectrum analyzer RF Amp HP8447F
3 k 0.01F 9 MIX OUT
The noise figure is calculated as follows: NF = ENR - 10 log (Y - 1) NF (dB): Noise figure
ENR (dB): ENR of noise source Y: Y = 10
N2-N1 10
N1 (dBm): Spectrum analyzer indication value at SW OFF. N2 (dBm): Spectrum analyzer indication value at SW ON. Remark This measurement measures DSB. To measure SSB, add 3 dB to NF above.
13
PC8001
4. CHARACTERISTIC CURVES
Figure 4-1.
4
Mixer Supply Current vs. Supply Voltage
3
Supply current ICC1 [mA]
2
1 Recommended operating range
0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Supply voltage VCC1 [V]
Figure 4-2.
Mixer Output Level vs. Mixer Input Level
(fMIX IN= 130 MHz, fOSC IN = 129.545 MHz, fMIX OUT = 455 kHz, VOSC IN = -15 dBm)
+20 +10 0
Mixer output level VMIX OUT [dBm]
-10 -20 -30 -40 -50 -60 -70 -80 -80 -70 -60 -50 -40 -30 -20 -10 0
Mixer input level VMIX IN [dBm]
14
PC8001
Figure 4-3.
Mixer Conversion Gain vs. Mixer Input Frequency
(VMIX IN= -30 dBm, VOSC IN = -15 dBm, fOSC IN = fMIX IN - fMIX OUT, fMIX OUT = 455 kHz)
30 Mixer conversion gain CG [dB]
20 3 dB
10
10
100
200
500
700
1000
Mixer input frequency fMIX IN [MHz]
Figure 4-4. IF Amplifier/RSSI Supply Current vs. Supply Voltage
2.0 1.8 1.6 Supply current ICC2 [mA] 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Supply voltage VCC2 [V] Recommended operating range
15
PC8001
Figure 4-5.
+30
IF Amplifier Output Level vs. IF Amplifier Input Level
+20
IF amplifier output level VIF OUT [dBm]
+10
3dB
0
-10
-20
-30 Limitting sensitivity (-91 dBm) -110 -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 0
IF amplifier input level VIF IN [dBm]
Figure 4-6.
250
IF Amplifier Output Phase vs. IF Amplifier Input Level
[deg]
= 11 deg TYP. 240
IF amplifier output phase
IF OUT
230
-90 -86
-80
-70
-60
-50
-40
-30
-20
-10 -6
0
IF amplifier input level VIF IN [dBm]
16
PC8001
Figure 4-7. RSSI Output Voltage vs. IF Amplifier Input Level
5
(The temperature characteristics curves)
3.0
2.5
2.0
RSSI output voltage VORS [V]
1.5
1.0
0.5
0 -120
-110
-100
-90
-80
-70
-60
-50
-40
-30
-20
-10
0
IF amplifier input level VIF IN [dBm]
Remarks 1.
TA = -30 C TA = +25 C TA = +85 C 2. The three temperature characteristic curves are virtually identical.
17
PC8001
5 5. TEST CIRCUIT EXAMPLE
50 0.01F 1F 1000 + pF 3V
50 1.5 k 0.01 F 0.01 F 13 MIX IN2 12 VCC1 11 OSC IN 10 GND 9 MIX OUT 8 FIL2
0.01 F
0.01 F 14 MIX IN1
PC8001GR
IF OUT 1 0.01 F
PD 2
RSSI OUT 3
FIL3 4
V
CC2
IF IN 6 0.01 F
FIL1 7
5
0.01 F 50 k
Note
+ 1000 1F pF
3V 50
3V 10 pF
1000 pF
0.01 F
Note The value of the capacitance connected to the IF OUT pin (No. 1) includes the capacitances of PCB wiring patterns and the tester. Remark In three cases of Mixer Input, Third Order Intercept and Noise Figure Measurement, refer to Figures 3-1, 3-2, and 3-6.
18
PC8001
6. PACKAGE DRAWINGS
14 PIN PLASTIC SHRINK SOP (225 mil)
14
8
detail of lead end
1 A
7 H I
55
F
G
J
C D MM
B
K
L
E
N P14GM-65-225B-2
NOTE Each lead centerline is located within 0.10 mm (0.004 inch) of its true position (T.P.) at maximum material condition.
ITEM A B C D E F G H I J K L M N
MILLIMETERS 5.40 MAX. 0.75 MAX. 0.65 (T.P.) 0.30 +0.10 -0.05 0.125 0.075 1.8 MAX. 1.44 6.2 0.3 4.4 0.9 0.15 +0.10 -0.05 0.5 0.2 0.10 0.10
INCHES 0.213 MAX. 0.030 MAX. 0.026 (T.P.) 0.012+0.004 -0.003 0.005 0.003 0.071MAX. 0.057 0.244 0.012 0.173 0.035 0.006+0.004 -0.002 0.020 -0.009 0.004 0.004
+0.008
19
PC8001
7. RECOMMENDED SOLDERING CONDITIONS
The following conditions must be met for soldering conditions of the
PC8001. For more details,
refer to our document "SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL" (IEI-1207). Please consolt with our sales offices in case other soldering process is used, or in case the soldering is done under different conditions. Types of Surface Mount Device
PC8001GR: 14-pin plastic shrink SOP (225 mil)
Soldedering process Infrared ray reflow Soldering conditions Peak temperature of package surface: 235 C or below, Reflow time: 30 seconds or below (210 C or higher), Number of reflow processes: MAX. 2 [Remark] (1) Please start the second reflow process after the temperature, raised by the first reflow process, returns to normal. (2) Please avoid removing the residual flux with water after the first reflow process. Partial heating method Terminal temperature: 300 C or below, Time: 3 seconds or below (Per one side of the device). ------ Symbol IR35-107-2
20
PC8001
Precautions Against Static Electricity
Caution
When handling the device, be careful to protect it from static electricity. exposure to a strong static electricity charge may destroy internal transistor junctions. During transportation and storage, place the device in the conductive tray or case originally provided by NEC for shipping, or conductive shock absorbing material, metal case, etc. During assembly, be sure to ground the device. Be careful not to place the device on a plastic board and do not touch the device's pins.
21
PC8001
[MEMO]
No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customer must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices in "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact NEC Sales Representative in advance. Anti-radioactive design is not implemented in this product.
M4 94.11
22


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